Hi,
Sorry if this question was done previously, I didn’t find any reference …
Checking the JS 001 standard, it is mentioned that all metallic connections to the die should be stressed under HBM. In case of the exposed/thermal/die pad connected to the substrate through a metallic die attach film, should it be stressed too? Is a common practice to stress the exposed pad?
Related to this item, and in the case of a non-conductive die attach film, the exposed pad should be considered like a no connect pin, so no stressed during HBM check, right? at least for JS 001. For the AEC Q100, where nc pins should be classified as non-supply pin and stressed. Nowadays, the AEC aligns with JS, it means that the nc pins shall not be stressed for any number of pins of the IC.
Yes, as per JS-001 and exposed pad is part of the “pin” definition and should be considered for testing if it is electrically connected to the die for HBM testing. As you mentioned, if it is not electrically connected to the die then it can be considered a no-connect pin and should not be tested in that case. This is a relatively new requirement, it was first introduced about 10yrs ago, but it was only more recently that it has been added. In some cases, this pad may be connected to the primary ground, and this may allow you to assess the risk of this pad by zapping other ground pins. As you also mentioned, per the AEC Q100 document (AEC Q100-002E), it does align with ANSI/ESDA/JEDEC JS-001 and as such, no-connect pins are also not zapped per that AEC spec (AEC Q100-002E).