I have a doubt regarding to Hi-pot tests and ESD protection. When a ESDS device is tested in this kind of test, there should exist ESD control strategies/items? For example, I have an e-motor device that has 2 connectors. 1 for High voltage tests and other one for low voltage test (it’s basically a signal control connector). The device will be tested, and both connectors will be used… I think that a voltage <35 V should be maintained on the connector pins (at least in the low voltage connector), but I don’t know if I’m correct.
I’m not the most experienced in hi-pot testing an ESDS device but I will try to answer your question.
I do know that personal safety comes first and that grounding personnel while doing the hi-pot testing would not be safe so this should not be done. You should ensure personnel grounding when placing the ESDS device at the testing station as well as when it is removed keeping in mind that you will want to make sure any residual charge from the hi-pot test have subsided. If there is any concern that charge may not dissipate quickly enough from the hi-pot test, you could use ionization before handling. You would also want to make sure the person doing the hi-pot test is careful to only contact the testing points.