Grounding/Equipotential Bonding System NEC 230-95

Since my factory has a grounding system based on NEC 230-95, I have this statement, could you confirm? (I just want to add that in my procedure, since it’s the grounding logic):

In accordance with NEC 230.95, the facility utilizes a solidly grounded wye electrical system with a properly bonded grounding electrode system that provides the required low-impedance fault-current path for equipment protection. ANSI/ESD S6.1 recognizes the facility’s AC equipment grounding system as an acceptable grounding and bonding reference for ESD control systems. All ESD common point grounds and bonding connections defined in this program are therefore tied into this NEC-compliant AC equipment grounding system to ensure equipotential bonding and compliance with ANSI/ESD S6.1 grounding requirements.

Thank you

Hello, is there anyone that can help me out with this confirmation?