Unlike Point #2, Point #3didn’t states that the structure which is in intimate contact with ESD Sensitive Devices has to provide ESD Shielding.
Which means can I conclude that a material which makes an intimate contact with an ESD Sensitive Device not necessarily need to be shielding??
Secondly, is it acceptable if I packed my FG (PCBAs) into tote box and then enclose the whole tote box with a big Static Shielding Bag?
I wouldn’t conclude that a material which makes intimate contact with an ESD Sensitive Device does not need to have shielding. The better way to read this is that discharge shielding is required in either case where the packaging makes or doesn’t make intimate contact with the ESDS item.
Yes, if your PCBAs are in a conductive or dissipative tote box within a bigger static shielded bag, this should meet the packaging requirements of ANSI/ESD S20.20 for transport outside an EPA